Products / Substrate Material / IC Package Laminate_

EPS-880A

Low CTE Material for Memory Card

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Application
EPS-880B

Lower CTE & Higher Stiffness Material for Memory Card & Module

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Application
EPS-880S

Lower CTE & High Stiffness Material for Memory Card & Module

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Application
EPS-880E

Ultra Low CTE & Higher Stiffness Material for Package Substrate

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Application
EPS-880H

Ultra Low CTE & Higher Stiffness Material for Package Substrate

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Application
EPS-880F

Low Dk & Df Material for Package Substrate

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Application