Despite the rapid development of flip chip and some other 3D packages, wire bonding is still the most common means of interconnection in IC packages. As the main assembly material in the wire bonding industry, gold wire has long been used in memory de

The market trend of electronic devices is at present. In the market of electric appliances and mobile AV equipment, smart phones and tablet PCS are growing rapidly. Global sales of smartphones rose from 650 million in 2012 to 790 million in 2013. It i

Topic: advanced semiconductor packaging technology time: Thursday, June 7, 2018 venue: suzhou jinjihu international conference center agenda: 08:30-09:00 audience registration 09:00-09:10 opening speech 09:10-09:40 KS Hybrid Hybrid